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Bonding Flexible Circuits and Flip Chips with Solder-filled Z-adhesives, Non-conductive adhesives and Fusible Coatings

Referentgranskad
Puhakka, Kimmo; Kulojärvi, Kari; Savolainen, P.; Kivilahti, J.K.
International Journal of Microelectronic Packaging Materials and Technologies1998Publicationer information ikon

Novel lignin based barrier material for packaging

Referentgranskad
Hult, Eva-Lena; Koivu, K.; Wrigstedt, P.; Ropponen, Jarmo; Asikkala, J.; Sipilä, J.; Tamminen, Tarja...
16th International Symposium on Wood, Fiber and Pulping Chemistry, ISWFPC 20112011Publicationer information ikon

An implementation of the HACCP system in the production of food-packaging material

Referentgranskad
DOI
10.1038/sj/jim/7000233
Sjöberg, Anna-Maija; Sillanpää, Jukka; Sipiläinen-Malm, Thea; Weber, Assi; Raaska, Laura
Journal of industrial microbiology and biotechnology2002Publicationer information ikon

Fiber-Based, Bio-Based and (Connected) Future of Packaging Design

Öppen tillgång
Nylander, Noora
The Publication Series of Lahti University of Applied Sciences2019Publicationer information ikon

Printed intelligence in packaging

Hurme, Eero; Sipiläinen-Malm, Thea
Paper360°2007Publicationer information ikon

Sustainable packaging materials with thin film deposition techniques

Vähä-Nissi, Mika
Specialty Papers Europe 2011, Frankfurt, 29 November - 1 December 20112011Publicationer information ikon

News in aseptic processing and packaging

Referentgranskad
Ahvenainen, Raija; Mattila-Sandholm, Tiina; Ohlsson, Thomas
VTT Symposium1991Publicationer information ikon

Towards traceable and sustainable plastic packaging: A perspective on recyclability of reusable smart packaging

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Palola, Sarianna; Javanshour, Farzin; Laurikainen, Pekka; Hakola, Liisa; Hakola, Elina; Tenhunen-Lun...
4th CIRCUL-A-BILITY Conference: Re-thinking Packaging for Circular & Sustainable Food Supply Cha...2024Publicationer information ikon

Modelling New Materials for Microelectronics Packaging

Referentgranskad
Kivilahti, J.
IEEE Transactions on Components, Packaging and Manufacturing Technology - Part B1995Publicationer information ikon

Note: Professionals' View of Consumers' Packaging Interactions - A Narrative Analysis:HUMAN-PACKAGING INTERACTION

DOI
10.1002/pts.2273
Ryynänen, Toni; Rusko, Elina
Packaging technology and science2016

Bonding Flexible Circuits and Flip Chips with Solder-filled Z-adhesives, Non-conductive adhesives and Fusible Coatings

Referentgranskad
1998

Novel lignin based barrier material for packaging

Referentgranskad
2011

An implementation of the HACCP system in the production of food-packaging material

Referentgranskad
DOI
10.1038/sj/jim/7000233
2002

Fiber-Based, Bio-Based and (Connected) Future of Packaging Design

Öppen tillgång
2019

Printed intelligence in packaging

2007

Sustainable packaging materials with thin film deposition techniques

2011

News in aseptic processing and packaging

Referentgranskad
1991

Towards traceable and sustainable plastic packaging: A perspective on recyclability of reusable smart packaging

Öppen tillgång
2024

Modelling New Materials for Microelectronics Packaging

Referentgranskad
1995

Note: Professionals' View of Consumers' Packaging Interactions - A Narrative Analysis:HUMAN-PACKAGING INTERACTION

DOI
10.1002/pts.2273
2016